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glossary of terms
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ACF: |
anisotropic conductive film - fine pitch heat seal technology, film type adhesive dispersed with metal coating particles |
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| COB: | chip on board - a technology that utilizes wire bonding to connect large-scale integrated circuits directly to printed circuit boards | ||
| COF: | chip on film - an assembly method for bonding integrated circuit chips and other components onto a flexible printed circuit | ||
| COG: | chip on glass - a process that connects integrated circuits directly to LCD panels without the need for wire bonding | ||
| DAB | digital audio broadcast modules | ||
| ECM: | electronic contract manufacturing | ||
| EMS: | electronic manufacturing services | ||
| FCB: | flip chip bonding | ||
| FPC: | flexible printed circuit - a patterned arrangement of printed wiring utilizing flexible base material with or without flexible cover layers | ||
| FPHS: | fine pitch heat seal | ||
| IC: | integrated circuit | ||
| IPO: | initial public offering | ||
| ISO: | International Standards Organization | ||
| LCD: | liquid crystal display | ||
| LSI: | large scale integrated circuit | ||
| ODM: | original design manufacturing - whereby the manufacturer owns the design of the products and the products are marketed under the customer's own brand name. | ||
| OEM: | original equipment manufacturer - whereby products are manufactured in whole or in part in accordance with the customer's specifications and are marketed under brand names designated by customers | ||
| OLB: | outer lead bonding - an advanced technology used to connect PCBs and large-scale integrated circuits with a large number of connectors | ||
| PCB: | printed circuit board | ||
| PDA: | personal digital assistant | ||
| PPM: | parts per million | ||
| PRC: | People's Republic of China | ||
| PVC: | polyvinyl chloride | ||
| RF: | radio frequency | ||
| SMT: | surface mount technology - a fully automated manufacturing system to mount or solder electrical and/or electronic components on the surface of a PCB | ||
| TAB: | tape automated bonding | ||
| TCP: | tape carrier packaging - a package form of IC or LSI | ||
| WB: |
wire bonding |
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| © 2007 Nam Tai Electronics, Inc. |
